软X射线投影光刻技术

• 作 者: 金春水 王占山 曹健林
• 机 构: 中国科学院长春光学精密机械与物理研究所,应用光学国家重点实验室!长春130022,中国科学院长春光学精密机械与物理研究所,应用光学国家重点实验室!长春130022,中国科学院长春光学精密机械与物理研究
• 出 处: 强激光与粒子束
• 发表日期: 2000年05期
• 关键词: 软X射线 投影光刻 集成电路

软 X射线投影光刻作为特征线宽小于 0 .1μm的集成电路制造技术 ,倍受日美两个集成电路制造设备生产大国重视。随着用于软 X射线投影光刻的无污染激光等离子体光源、高分辨率大视场投影光学系统、无应力光学装调工艺、深亚纳米级镜面加工和多层膜制备、低缺陷反射式掩模、表面成像光刻胶、精密扫描机构等关键技术均取得了突破

Soft X-ray projection lithography as a feature line width of less than 0 .1μm integrated circuit manufacturing technology, much Japan and the United States two integrated circuit manufacturing equipment manufacturers attention. With the use of non-polluting laser plasma light sources for soft X-ray projection lithography, high-resolution large field projection optical systems, stress-free optical setup processes, deep sub-nanoscopic mirror processing and multilayer film fabrication, low defect reflective Masses, surface imaging photoresist, precision scanning mechanism and other key technologies have made a breakthrough