论文部分内容阅读
概述了应用热可塑性树脂和一次性多层层压的多层板ALAP基板的制造工艺。该工艺包括(1)采用高尺寸精度的单面覆铜箔热可塑性树脂片;(2)形成图形以后激光钻孔:(3)填充金属胶;(4)叠层和位置重合以后一次性层压。通过层压时的金属烧结和扩散接合,实现了层间连接和多层粘结。PALAP基板适用于利用热可塑树脂特性的高频制品或者利用堆积导通孔的多针封装,可以缩短交货期和实现材料再循环。
The manufacturing process of ALAP substrate using thermoplastic resin and one-time multi-layer laminate was outlined. The process comprises the following steps: (1) adopting a single-sided copper-clad thermoplastic resin sheet with high dimensional accuracy; (2) laser drilling after forming a pattern; (3) filling a metal adhesive; (4) Pressure Interlayer bonding and multilayer bonding are achieved by metal sintering and diffusion bonding during lamination. PALAP substrates are suitable for high-frequency products that utilize the properties of thermoplastic resins or multi-pin packages that utilize stacked vias to reduce lead-times and material recycling.