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引起集成电路失效的因素很多,封装气密性不良就是其中之一。为了提高可靠性,对器件进行检漏是很有必要的。过去的无损氦质谱检漏法(亦称轰击法)可对器件微细漏气进行有效筛选,但它不能解决粗漏气的筛选问题。因此,粗细检漏往往只好分别进行。为了提高检漏准确度和效率,我们试图寻找一种粗细检漏同时进行的方法。我们从1975年初开始进行这方面工作,经过一段时间的实验,在一定范围内可以同时进行粗细检漏,目前正准备用到实际科研工作中去。我们称这种方为“积累针探法”,下面对此方法进行详细介绍。
Cause many factors in the failure of integrated circuits, poor packaging gas tightness is one of them. In order to improve reliability, it is necessary to leak the device. The past non-destructive helium mass spectrometry leak detection method (also known as bombardment method) can effectively filter the device for micro-leak, but it can not solve the problem of coarse-leak screening. Therefore, the thickness of leak often had to separately. In order to improve the accuracy and efficiency of leak detection, we tried to find a way to conduct the simultaneous leak detection. We started this work in early 1975, and after a period of experiments, we can carry out thickness leak detection within a certain range at the same time. We are now ready to use actual scientific research. We call this kind of party “the accumulation of pin exploration method”, which is described in detail below.