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惠普(HP)公司和美国加州大学(UCLA)获得美国颁发的有关结构复杂的逻辑芯片技术专利,利用该专利技术,能在分子级水平上构建芯片。现有芯片制造需要经过多重昂贵的工艺流程,以建立计算机电路的综合布线模式。该专利称,可通过一种简单的栅格形式进行布线——每一个布线仅有几个原子的宽度,然后,通过单分子的电子开关进行互连。实验
HP and the University of California, Los Angeles (UCLA) received patents from the United States on the structure of complex logic chip technology, using the patented technology to build chips at the molecular level. Existing chip manufacturing needs to go through multiple and expensive process to establish the integrated wiring mode of computer circuit. The patent states that wiring can be done in a simple grid format-each wiring has only a few atoms in width and then interconnected by a single-molecule electronic switch. experiment