Anodic bonding using a hybrid electrode with a two-step bonding process

• 作 者: 罗巍 解婧 张阳 李超波 夏洋
• 机 构: Key Laboratory of Microelectronics Devices & Integrated Technology,Institute of Microelectronics.Chi
• 出 处: 半导体学报
• 发表日期: 2012年06期
• 关键词: bonding anodic wafer packaging bonded bubble boron cathode listed accomplished

A two-step bonding process using a novel hybrid electrode is presented.The effects of different electrodes on bonding time,bond strength and the bonded interface are analyzed.The anodic bonding is studied using a domestic bonding system,which carries out a detailed analysis of the integrity of the bonded interface and the bond strength measurement.With the aid of the hybrid electrode,a bubble-free anodic bonding process could be accomplished within 15-20 min,with a shear strength in excess of 10 MPa.These results show that the proposed method has a high degree of application value,including in most wafer-level MEMS packaging.

A two-step bonding process using a novel hybrid electrode is presented. These effects of different electrodes on bonding time, bond strength and the bonded interface are analyzed. Anodic bonding is studied using a domestic bonding system, which carries out a detailed analysis of the integrity of the bonded interface and the bond strength measurement. With the aid of the hybrid electrode, a bubble-free anodic bonding process could be accomplished within 15-20 min, with a shear strength in excess of 10 MPa.These results show that the proposed method has a high degree of application value, including in most wafer-level MEMS packaging.