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随着电子生产技术的发展,广泛地采用波峰焊接技术,要求将元器件成批大量地一次焊接到印制板上,由于焊接工艺参数对每个焊点是一样的,因而对元器件的引出线提出越来越高的要求。它不仅要求引出线瞬间可焊性好,而且在贮存相当一段时间内仍保持其良好的可焊性。这个问题若不解决,必将妨碍电子工业的大生产和产品质量的提高,影响产品的竞争能力和电子元器件的出口。一九八一年在部局领导的重视和关怀下,我局的引线可焊性研究工作进入了全面攻关的新阶段。自此以后有关提高可焊性的新技术、新工艺、新材料不断涌现。如上无十七厂、元件五厂的成品光亮镀锡,上无六厂的复合电镀新工艺,电子管厂的CP线,上无三厂的阻容元件化学清洗工艺等技术成果,在实际生
With the development of electronic production technology, widely used wave soldering technology, requiring a large number of components to a large number of soldered to the printed circuit board, the welding process parameters for each solder joint is the same, so the components of the lead Line made higher and higher requirements. It not only requires the lead-in wire to be instantly solderable but also retains its good solderability for a considerable period of storage. If this problem is not solved, it will certainly hinder the large-scale electronics manufacturing industry and product quality improvement, affecting the competitiveness of products and the export of electronic components. In 1981, with the attention and care of the leaders of the ministries and commissions, the soldering work of lead wire of our bureau has entered a new stage of comprehensive research. Since then, new technologies, new processes and new materials to improve solderability continue to emerge. As above seventeen factories, five components of the bright tin plating plant, no six plants on the new composite plating process, the CP line of the tube plant, the three plants on the RCA chemical cleaning technology and other technical achievements, the actual students