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2017.10.28—29中国天津第一届全国绝缘材料与封装技术学术研讨会(IMPT2017)将于2017年10月28-29日在中国天津举行,本次会议的主题包括绝缘材料、绝缘技术、封装技术与工艺、可靠性分析、封装失效分析与评估以及其他相关领域。此次大会邀请到了天津大学等众多高校与机构专家教授参会并做精彩报告。会议采用全英文论文投稿,所有参会的论文将统一海外发行出版,并提交EI数据库检索。本次大会的征稿主题包括但
2017.10.28-29 Tianjin, China The First National Symposium on Insulating Materials and Packaging Technologies (IMPT2017) will be held in Tianjin, China from October 28 to 29, 2017. Topics for this conference include Insulation Materials, Insulation Technology, Packaging Technology and process, reliability analysis, package failure analysis and evaluation and other related fields. The conference invited Tianjin University and many other universities and institutions experts and professors attended the meeting and made wonderful reports. Conference papers submitted in English, all participating papers will be unified overseas publication, and submitted to EI database search. The topics for this conference include but