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套刻性能是现代高精度步进扫描投影光刻机的重要性能指标之一。提出了一种基于镜像焦面检测对准标记(简称“镜像焦面检测对准标记”)的光刻机套刻性能原位测量技术。该技术通过对曝光在硅片上的镜像焦面检测对准标记图形进行光学对准,利用标记图形对准位置与理想位置偏差实现套刻性能的原位检测。实验结果表明该技术在进行套刻误差的精确测量的同时还可以全面、定量地计算影响光刻机单机套刻误差的场内参量及场间参量。与目前套刻性能原位测量技术相比,该技术有效地避免了测量精度对轴向像质限制的依赖,简化了光刻机整机性能检测的过程。
Set of engraving performance is one of the important performance indicators of modern high-precision step-and-scan projection lithography machine. An in-situ measurement technology of lithography engraving performance based on mirror image focus detection alignment mark (referred to as mirror image focus detection alignment mark) is proposed. In this technology, the in-situ detection of the lithography performance is realized by optical alignment of the alignment mark pattern detected by the mirrored focal plane exposed on the silicon wafer and the deviation of the alignment position and the ideal position of the mark pattern. The experimental results show that this method can calculate the field parameters and field parameters that influence the single set error of lithography machine in a comprehensive and quantitative way while accurately measuring the overlay error. Compared with the current in situ measurement technology of overlay performance, this technology effectively avoids the dependence of the measurement accuracy on the axial image quality limitation and simplifies the whole machine performance detection process.