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高密度组装技术的发展降低了费用,使系统体积更小而且性能更好。具有细线技术的高性能的印制电路板达到了导线宽度小于0.1mm、间距小于0.2mm。印制电路板更高密度的限制因素是机械钻通孔,特别是要装配节距小于0.2mm精细线技术和相应减小导通孔直径以达最小输出面积的现代集成电路(ICs),遇到了困难。为了满足这些要求,研究了用光敏聚酰亚胺作为印制电路板上层的绝缘薄膜的互连系统。为了阐明方法的可行性,建立了一个包括测量接触电阻在内的测试结构的试验模型。
The development of high-density assembly technology reduces costs, makes the system smaller and performs better. High-performance printed circuit boards with thin-wire technology achieve wire widths of less than 0.1 mm and spacing of less than 0.2 mm. The limiting factor for the higher density of printed circuit boards is through-drilled vias, in particular, the assembly of fine line technology with pitch less than 0.2 mm and correspondingly smaller integrated circuits (ICs) with reduced via diameters for minimum output area area, To the difficulty. In order to meet these requirements, the use of photosensitive polyimide as a printed circuit board insulation film interconnection system. In order to clarify the feasibility of the method, a test model including a test structure for measuring contact resistance was established.