Propagation delay and power dissipation for different aspect ratio of single-walled carbon nanotube

• 作 者: Tanu Goyal Manoj Kumar Majumder Brajesh Kumar Kaushik
• 机 构: Department of ECE, IEC College of Engineering and Technology,Department of E&CE, Indian Institute of
• 出 处: Journal of Semiconductors
• 发表日期: 2015年06期
• 关键词: carbon nanotube through-silicon vias equivalent RLC circuit model propagation de

Through-silicon vias(TSVs) have provided an attractive solution for three-dimensional(3D) integrated devices and circuit technologies with reduced parasitic losses and power dissipation, higher input-output(I/O) density and improved system performance. This paper investigates the propagation delay and average power dissipation of single-walled carbon nanotube bundled TSVs having different via radius and height. Depending on the physical configuration, a comprehensive and accurate analytical model of CNT bundled TSV is employed to represent the via(vertical interconnect access) line of a driver-TSV-load(DTL) system. The via radius and height are used to estimate the bundle aspect ratio(AR) and the cross-sectional area. For a fixed via height, the delay and the power dissipation are reduced up to 96.2% using a SWCNT bundled TSV with ARD300 : 1 in comparison to ARD6 : 1.

Through-silicon vias (TSVs) have provided attractive solutions for three-dimensional (3D) integrated devices and circuit technologies with reduced parasitic losses and power dissipation, higher input-output (I / O) density and improved system performance. This paper investigates the propagation delay and average power dissipation of single-walled carbon nanotube bundled TSVs having different via radius and height. According to the physical configuration, a comprehensive and accurate analytical model of CNT bundled TSV is employed to represent the via the (vertical interconnect access) line of a driver-TSV-load (DTL) system. The via radius and height are used to estimate the bundle aspect ratio (AR) and the cross-sectional area. For a fixed via height, the delay and the power dissipation are reduced up to 96.2% using a SWCNT bundled TSV with ARD300: 1 in comparison to ARD6: 1.