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采用表面印迹技术合成了铜离子印迹聚烯丙基胺硅胶材料(IIP-PAA/SiO_2),通过静态实验研究了吸附剂浓度W0对Cu(II)离子在IIP-PAA/SiO_2材料上吸附的影响.结果表明,随着W0增加,Cu(Ⅱ)/IIP-PAA/SiO_2体系的吸附等温线下降,吸附体系具有明显的吸附剂浓度效应.实验数据显示吸附剂的平衡吸附量Qe与液相平衡浓度Ce和吸附剂浓度W0之间具有相关性,通过C_e/W_0(液相平衡离子浓度与吸附剂浓度的比值)因子来修正经典Langmuir模型参数,所得的修正Langmuir等温式能描述和预测不同吸附剂浓度W0水平下的平衡吸附量Qe,表明该修正模型具有合理性.
Copper ion imprinted polyallylamine silica gel (IIP-PAA / SiO 2) was synthesized by surface-imprinting technique. The effect of adsorbent concentration W0 on the adsorption of Cu (II) on IIP-PAA / SiO 2 was investigated by static experiments The results showed that with the increase of W0, the adsorption isotherms of Cu (Ⅱ) / IIP-PAA / SiO 2 system decreased, and the adsorption system had obvious effect of adsorbent concentration.The experimental data showed that the equilibrium adsorption capacity Qe of the adsorbent was in equilibrium with the liquid phase The concentration of Ce has a correlation with the concentration of sorbent W0, and the parameters of classical Langmuir model are modified by the factor of C_e / W_0 (ratio of liquid equilibrium ion concentration to sorbent concentration). The modified Langmuir isotherm can describe and predict different sorption The equilibrium adsorption capacity Qe at the W0 level showed that the model was reasonable.