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前言近几年来半导体集成电路工艺发展迅速,逻辑电路已由中规模集成进入大规模集成,已有一些高速大型计算机是用大规模集成的逻辑电路组装的。如:美国 Amdahl 470V/6、日本的 M 系列机和 ACOS 800～900系列。目前已开始研制超大规模集成电路,并且逐步向高速单片微处理机的方向努力。电路的研制工作主要是结合新工艺进行的,目的是为了提高集成度、提高速度、减少功耗、提高产品的合格率和可靠性等。对于高速大型机需要的电路来说,提高速度的重要途径之一就是采用提高集成度和组装密度。美国大型计算机 Cray-1的组装就充分说明它的必要性。高速大型机在国
Preface In recent years, semiconductor integrated circuit technology has developed rapidly, the logic circuit has been integrated into the large-scale integration, there are some high-speed large-scale computer is the use of large-scale integrated logic circuit assembly. Such as: the United States Amdahl 470V / 6, Japan’s M series machines and ACOS 800 ~ 900 series. Has begun to develop VLSI, and gradually to high-speed single-chip microprocessor direction. Circuit development work is mainly carried out in conjunction with the new technology, the purpose is to improve the integration, increase speed, reduce power consumption, improve product yield and reliability. One of the important ways to speed up the circuitry needed for high-speed mainframes is to increase integration and assembly density. The assembly of the U.S. mainframe computer Cray-1 fully demonstrates its necessity. High-speed mainframe in the country