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基于金属圆筒和高分子材料封装对光纤光栅的应力响应的增敏作用,设计了一种新的光纤光栅传感器结构,推导出了该传感器的压力增敏的数学模型,给出了该传感器的压力灵敏度系数与封装高分子材料参数和结构尺寸参数之间的数学表达式,通过实验测出其压力灵敏度为-5.02×10-3/MPa,比裸光纤光栅的压力灵敏度(-2.78×10-6/MPa)提高了1 800倍.对于这种基于金属圆筒和高分子材料封装结构的应力增敏模型,通过调节金属圆筒的尺寸、高分子材料的直径、杨氏弹性模量、泊松比等参数可方便地改变和调整传感器的压力灵敏度,以适应不同的场合.
Based on the sensitization effect of metal cylinder and polymer encapsulation on the stress response of FBG, a new FBG sensor structure was designed, and the mathematical model of pressure sensitization of the FBG sensor was deduced. The pressure sensitivity is -5.02 × 10-3 / MPa, which is lower than that of bare fiber grating (-2.78 × 10- 6 / MPa) increased by 1800. For this stress-sensitization model based on the metal cylinder and polymer packaging structure, by adjusting the size of the metal cylinder, the diameter of the polymer material, Young’s modulus, Song than other parameters can easily change and adjust the pressure sensor sensitivity to adapt to different occasions.