论文部分内容阅读
首先简要介绍了目前实现可延展柔性无机电子延展性的主要原理及方式,分析了目前存在的问题;其次,总结了目前提高可延展柔性无机电子延展性能的主要设计,并对可延展柔性无机电子互连结构的力学特性发展现状进行了分析。其中重点探讨了目前存在的互连导线失效、异质界面的力学及其可靠性问题的研究现状;最后,针对目前可延展柔性无机互连结构存在的界面可靠性问题,介绍了本课题组在该方面的数值仿真工作。主要分析了可延展电子典型互连结构单元——马蹄形、Z字形结构基底应力集中问题,并进行了上述结构界面剥离的仿真分析。
At first, the main principle and method of realizing extensible flexible inorganic electronic ductility are briefly introduced, and the existing problems are analyzed. Secondly, the main design of improving extensible flexible inorganic electronic ductility is summarized, and the extensibility of flexible inorganic electron The development of mechanical properties of interconnected structures is analyzed. The research status of interconnection wire failure, the mechanics of the heterogeneous interface and its reliability problems are discussed emphatically. Finally, in view of the interface reliability problem of ductile flexible inorganic interconnect structure, The numerical simulation work in this area. The paper mainly analyzes the problem of substrate stress concentration in the typical interconnected structure of ductile electrons, such as horseshoe and zigzag structure, and carries out the simulation analysis of the interface peeling.