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采用立式烧结熔渗法制备的CuW/Cu0.89wt%Cr整体材料经固溶时效处理后,对其在不同热循环条件下的结合面强度进行了研究。结果表明,在室温～500℃温度范围内,随着热循环次数的增加,整体材料的结合面强度和CrCu端合金显微硬度略有提高。而在室温至600℃热循环温度区间内,结合强度和CuCr合金显微硬度随热循环次数的增加而下降。对不同热循环条件下CuCr端合金组织的研究表明,上限温度为500℃时,晶粒没有发生再结晶现象,析出相面心立方的Cr相非常细小、分散,且与Cu基体保持良好的共格关系;而当热循环上限温度为600℃时,晶粒发生了再结晶长大,析出相明显粗化,此时析出的体心立方的Cr相已与Cu基体失去完全共格关系。
The CuW / Cu 0.89wt% Cr monolithic material prepared by vertical sintering infiltration method was studied by the solution aging treatment under different thermal cycling conditions. The results show that the strength of the bonding surface and the microhardness of the CrCu alloy slightly increase with the increase of the number of thermal cycles at room temperature to 500 ℃. In the temperature range from room temperature to 600 ℃, the bonding strength and the microhardness of CuCr alloy decrease with the increase of the number of thermal cycles. The study of CuCr alloy under different thermal cycling shows that there is no recrystallization at the maximum temperature of 500 ℃. The Cr phase precipitated in the face-centered cubic phase is very fine and dispersed and keeps good with Cu matrix Lattice relationship. When the maximum temperature of thermal cycling is 600 ℃, the grains recrystallize and grow, and the precipitates are obviously roughened. At this time, the body-centered cubic Cr phase has lost its complete coherent relationship with the Cu matrix.