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键合头是倒装键合设备的核心功能部件,主要用于完成芯片的拾取、传送、蘸胶和键合。针对键合头常因结构刚度不足在冲击载荷的作用下产生较大的结构弹性变形和残余振动的问题,采用有限元法研究了键合头的静态力学特性,并运用基于参数灵敏度技术的优化方法对薄弱环节进行了多目标优化。结果表明:优化前的键合头最大变形量超出了键合头±10μm的设计要求,拾取臂的长悬臂结构刚度不足是导致大变形的主要原因。针对薄弱环节优化后的键合头最大变形量为8.186μm,且结构质量减少了13.2%,满足设计要求。文中研究方法有效改善并提高了键合头的静态力学特性,对键合机整体的优化设计有重要意义。
Bonding heads are the core features of flip-chip bonding equipment and are used primarily for chip pick-up, transfer, dip and glue bonding. Aiming at the problem that the bond head often has a large structural elastic deformation and residual vibration under the effect of impact load due to the lack of structural rigidity, the static mechanical properties of the bond head are studied by the finite element method, and the optimization based on the parameter sensitivity technique The method of multi-objective optimization of the weak links. The results show that the maximum deformation of the bonding head before optimization is beyond the design requirement of ± 10μm bond head. The short structural rigidity of the pick arm is the main reason for the large deformation. The maximum deformation of the bonding head optimized for the weak link is 8.186μm, and the quality of the structure is reduced by 13.2%, which meets the design requirements. The research method in this paper can effectively improve and improve the static mechanical properties of the bonding head, which is of great significance to the optimal design of the bonding machine as a whole.