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使用动态热机械分析仪(DMA)对硅泡沫材料在高温下的短时压缩应力松弛性能进行了研究。使用扫描电镜对硅泡沫样品高温压缩试验后的微观形貌进行了观察。结果表明,温度升高到100℃以后,在一定的初始压缩率下,硅泡沫样品的短时压缩应力松弛曲线均出现了不同程度的下降。分析可能是由于高温下硅泡沫材料发生化学松弛,骨架的基体材料发生了部分分解断链。
The dynamic thermal mechanical analyzer (DMA) was used to study the short-time compressive stress relaxation behavior of silicon foam at high temperature. The microstructure of silicon foam samples after high temperature compression test was observed by SEM. The results show that the short-time compressive stress relaxation curves of silicon foam samples all show different degrees of reduction at a certain initial compressibility after the temperature is increased to 100 ℃. The analysis may be due to chemical relaxation of the silicon foam at high temperatures, the matrix of the matrix material partially decomposed and broken chains.