电子设备的通风格栅设计

• 作 者: 车明康
• 出 处: 电子机械工程
• 发表日期: 1991年05期
• 关键词: 电子设备 半导体器件 电磁干扰 冷却能力 故障率 自然对流 压降 空气流动 热分析 散热能力

格栅设计通常是冷却能力、安全性和EMI(电磁干扰)等互为矛盾的需求之间的折衷。众所周知,高温是电子设备的主要祸根。一般,半导体器件结温度每上升15℃,该器件故障率就会大致提高1倍。因此,热分析和冷却系统设计应该是电子设备设计的一个主要部分之一。但是,这些设备的设计者面临着进退两难的问题。自由的、不受限的空气流是使电子元器件散热的最佳和最经济的方法。但是又必须把众多的电子器件包封在机壳内,使其免受环境的

Grid design is often a compromise between conflicting requirements such as cooling capacity, safety and EMI (electromagnetic interference). As we all know, high temperature is the main curse of electronic equipment. In general, every 15 ° C rise in junction temperature of a semiconductor device results in a roughly one-fold increase in the device failure rate. Therefore, thermal analysis and cooling system design should be one of the major components of electronic equipment design. However, designers of these devices are faced with the dilemma. Free, unrestricted airflow is the best and most economical way to dissipate electronic components. However, a large number of electronic devices must be enclosed within the enclosure to protect them from the environment