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在不同温度下,对W70Cu30合金坯采用多道次热轧试验。结果表明,在700℃时,多道次热轧可以获得板厚为0.2mm,相对密度达99.92%的W-Cu合金薄板。轧制过程中,合金板材中Cu相和W相在轧制应力作用下发生变形、滑动,Cu相均匀填充在W颗粒周围,形成了致密的网络状组织,使电导率、热导率较轧制前分别提高了23%和31.31%。同时板材致密度提高和形变强化,使其显微硬度较轧制前也大幅提高。在轧制变形过程中,W-Cu合金板材的物相组成没有发生变化,仅由W和Cu两相组成。轧制后W70Cu30合金板材的断裂方式由粘结相Cu的韧性断裂和W颗粒的穿晶断裂组成。
At different temperatures, the W70Cu30 alloy billet multi-pass hot rolling test. The results show that W-Cu alloy sheet with thickness of 0.2mm and relative density of 99.92% can be obtained by multi-pass hot rolling at 700 ℃. During the rolling process, the Cu and W phases in the alloy sheet deform and slide under the action of rolling stress, and the Cu phase is uniformly filled around the W particles to form a dense network-like structure, so that the electrical conductivity and the thermal conductivity are lower than those of the rolling Before the system increased by 23% and 31.31% respectively. At the same time, sheet density and deformation enhancement, so that the micro-hardness than before rolling also increased significantly. During the rolling deformation, the phase composition of W-Cu alloy sheet has not changed, only composed of W and Cu two phases. The fracture mode of the W70Cu30 alloy sheet after rolling consists of the ductile fracture of the binder phase Cu and the transgranular fracture of the W particle.