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用电镀工艺制备了Fe-Ni镀层,研究了还原气氛保护下共晶Sn3.8Ag0.7Cu焊料在Fe-Ni镀层上的反应润湿行为。结果表明:在共晶Sn3.8Ag0.7Cu与Fe-74Ni反应润湿体系观察到了伪部分润湿行为。在铺展球冠的前沿,可以明显地看到有液态膜伸出主液体铺展前沿。随着回流时间的增加,液态膜逐渐长大。共晶Sn3.8Ag0.7Cu焊料与Fe-74Ni电镀合金层的液固界面生成了一层FeSn2化合物,还有大量Cu/Ni/Sn化合物进入焊料内部。
The Fe-Ni coating was prepared by electroplating process. The reaction wetting behavior of the eutectic Sn3.8Ag0.7Cu solder on Fe-Ni coating under reducing atmosphere was studied. The results show that the pseudo-partial wetting behavior is observed in the eutectic Sn3.8Ag0.7Cu and Fe-74Ni reaction wetting systems. At the forefront of spreading the crown, it is evident that there is a liquid film extending out of the main liquid spreading front. As the reflow time increases, the liquid film gradually grows. Eutectic Sn3.8Ag0.7Cu solder and Fe-74Ni plating alloy layer liquid-solid interface generated a layer of FeSn2 compounds, there are a large number of Cu / Ni / Sn compounds into the solder inside.