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在Sn3Ag0.5Cu(SAC)基础上添加质量分数3.0%Bi和0.05%Cr制备出一种新型无铅焊料合金,研究由其制备的Cu/Solder/Cu焊点在150℃分别时效0,24,168,500及1000h后的力学性能及焊点界面金属间化合物(IMC)。结果显示,Sn3Ag0.5Cu3Bi0.05Cr(SACBC)比SAC具有更好的熔融区间(210~217℃)。焊态和时效态的Cu/SACBC焊点拉伸强度均高于Cu/SAC的强度,且随时效时间下降平缓。Cu/SACBC焊点时效168h和1000h后的强度相对于焊态的仅下降了4.2MPa和5MPa;而Cu/SAC焊点的界面结合强度则明显下降,时效1000h后的强度仅为焊态的1/2。Cu/SACBC焊点随着时效时间的延长,其拉伸断裂失效由准解理断裂过渡为脆性解理断裂。
A new type of lead-free solder alloy was prepared by adding 3.0% Bi and 0.05% Cr on the basis of Sn3Ag0.5Cu (SAC). The Cu / Solder / Cu solder joints prepared from them were aged at 150 ℃ for 0,24,168,500 and Mechanical Properties and Interfacial Intermetallics (IMC) after 1000h. The results show that Sn3Ag0.5Cu3Bi0.05Cr (SACBC) has a better melting range (210 ~ 217 ℃) than SAC. The tensile strength of Cu / SACBC solder joints in both as-welded and aged Cu-SACBC joints is higher than that of Cu / SAC joints, and decreases slowly with the aging time. The strength of Cu / SACBC joints decreased only 4.2MPa and 5MPa respectively after welding for 168h and 1000h, while the bonding strength of Cu / SAC joints decreased obviously, and the strength after 1000h was only 1 /2. With the extension of aging time, Cu / SACBC solder joint transition from quasi-cleavage fracture to brittle cleavage fracture.