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研究了150℃等温时效过程中无Pb焊料Sn3.0Ag0.5Cu与Cu基体间金属间化合物(intermetallic compound,IMC)的生长速率及形貌演化,以及IMC的生长演化对焊锡接点力学性能的影响.结果表明,IMC厚度与等温时效时间的平方根呈线性增长关系,随着等温时效时间的增加,IMC与焊料界面由初始的凹凸不平的扇贝状形貌逐渐变得平坦.IMC厚度和界面粗糙度共同影响焊锡接点的拉伸强度和断裂模式,随着时效时间的增加,IMC变厚,同时焊料与IMC界面变平坦,断裂模式由焊料内部的韧性断裂逐渐转变为IMC层内部的脆性断裂.
The growth rate and morphological evolution of intermetallic compound (IMC) between Pb-free solder Sn3.0Ag0.5Cu and Cu matrix during 150 ℃ isothermal aging and the effect of growth and evolution of IMC on the mechanical properties of solder joints were investigated. The results show that the thickness of IMC increases linearly with the square root of isothermal aging time, and the interface between IMC and solder gradually becomes flat with the initial irregularity of scalloped morphology with the increase of isothermal aging time.IMC thickness and interface roughness are common As the aging time increases, the IMC becomes thicker and the interface between solder and IMC becomes flat. The fracture mode gradually changes from ductile fracture in the solder to brittle fracture in the IMC layer.