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The electromagnetic shielding film has drawn much attention due to its wide applications in the integrated circuit package,which demands a high surface quality of epoxy resin.However,gaseous Cu will splash and adhere to epoxy resin surface when the Cu layer in PCB receives enough energy in the process of laser cutting,which has a negative effect on the quality of the shielding film.Laser polishing technology can solve this problem and it can effectively improve the quality of epoxy resin surface.The paper studies the mechanism of Cu powder spraying on the compound surface by 355 nm ultraviolet(UV) laser,including the parameters of laser polishing process and the remains of Cu content on compound surface.The results show that minimal Cu content can be realized with a scanning speed of 700 mm/s,a laser frequency of 50 kHz and the distance between laser focus and product top surface of-1.3 mm.This result is important to obtain an epoxy resin surface with high quality.
The electromagnetic shielding film has drawn much attention due to its wide applications in the integrated circuit package, which demands a high surface quality of epoxy resin. Host, gaseous Cu will splash and adhere to epoxy resin surface when the Cu layer in PCB receives enough energy in the process of laser cutting, which has a negative effect on the quality of the shielding film. Laser polishing technology can solve this problem and it can effectively improve the quality of epoxy resin surface. The paper studies the mechanism of Cu powder spraying on the the surface of the Cu content can be realized with a scanning speed of 700 mm / s, a laser frequency of 50 kHz and the distance between laser focus and product top surface of-1.3 mm.This result is important to obtain an epoxy resin surface with high quality.