论文部分内容阅读
数千兆串行标准的出现促使功率预算和时序容限下降。因此,准确分析时域和频域中的信号路径和互连情况,对于全面了解高速串行设计中信号损失和串音的影响至关重要。PCI Express、串行ATA、XAUI和Infiniband等业界标准,逐渐开始要求使用S参数和阻抗测量来描述这些影响的特征,同时确保系统的互操作性。泰克公司近日宣布推出新型DSA8200数字串行分析仪取样示波器,包含全新的远程TDR(时域反射技术)取样电子模块和增强型IConnect软件,可针对当前和各种新兴标准的1Gbps～12.5Gbps串行数据网络,实现准确且可重复的S参数测量。
The advent of multi-gigabit serial standards has led to lower power budgets and timing margins. Therefore, accurate analysis of signal paths and interconnections in the time and frequency domains is crucial to fully understand the effects of signal loss and crosstalk in high-speed serial designs. Industry standards such as PCI Express, Serial ATA, XAUI, and Infiniband are beginning to demand the use of S-parameters and impedance measurements to characterize these effects while ensuring system interoperability. Tektronix Inc. today announced the availability of the new DSA8200 digital serial analyzer sampling oscilloscope, including the new remote TDR (Time Domain Reflectometry) sampling electronics and enhanced IConnect software for current and emerging standards of 1Gbps to 12.5Gbps serial Data network for accurate and repeatable S-parameter measurements.