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微细磨粒砂轮的试验研究是当前砂轮试制的主要发展趋势。本文叙述了超微细磨粒的电泳特性，并利用该特性试验研制一种新型的高密度低结合度超微细磨粒电泳砂轮，在ＭＭ７ １２０Ｈ精密磨床上，应用该砂轮对单晶硅片进行实际磨削加工，试验结果表明，通过控制磨削参数，可以降低工件表面粗糙度。
The experimental study of fine abrasive wheel is the main development trend of the current grinding wheel trial. This paper describes the ultrafine abrasive particles electrophoresis characteristics and the use of this feature test developed a new type of high density low binding ultrafine abrasive wheel, MM7 120H precision grinder, the use of the wheel of the actual silicon wafer Grinding, the test results show that by controlling the grinding parameters, can reduce the workpiece surface roughness.