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为了改善Ni基钎料钎焊接头脆硬的共晶组织,本文采用BNi7+9%Cu复合钎料对纯镍进行真空钎焊。结果表明:温度越高,间隙越大,扩散影响区越大,钎缝区显微硬度越低,扩散影响区显微硬度越高。当钎焊接头间隙为30μm,温度960℃时,钎缝接头主要由等温凝固区、非等温凝固区和扩散影响区组成。等温凝固区为富(Cr、Cu)的γ(Ni)固溶体,非等温凝固区为γ(Ni)+Ni3P共晶组织,扩散影响区为少量的共晶组织和γ(Ni)固溶体;而温度980℃时,钎焊接头是由中心的Ni3P组织和扩散影响区的γ(Ni)固溶体组成。当钎焊接头间隙为100μm时,其扩散影响区的范围要比30μm的大,在960℃时,钎缝填充不好,有很多孔洞。
In order to improve the brittle eutectic structure of Ni-based brazing filler metal, vacuum brazing of pure nickel was carried out using BNi7 + 9% Cu composite brazing filler metal. The results show that the higher the temperature is, the larger the clearance is and the larger the influence zone is. The lower the microhardness is, the higher the microhardness is. When the solder joint gap is 30μm and the temperature is 960 ℃, the solder joint mainly consists of isothermal solidification zone, non-isothermal solidification zone and diffusion-affected zone. The isothermal solidification zone is rich (Cr, Cu) γ (Ni) solid solution, and the non-isothermal solidification zone is γ (Ni) + Ni3P eutectic structure with a small amount of eutectic structure and γ At 980 ℃, the braze joint is made up of central Ni3P microstructure and γ (Ni) solid solution in the diffusion affected zone. When the solder joint gap is 100μm, the range of its diffusion influence zone is larger than 30μm. At 960 ℃, the brazing seam filling is not good and there are many holes.