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通过采用一系列与集成电路BGA(球栅阵列)、Flip Chip(倒装焊芯片)真实焊点体积接近的不同尺寸的典型“三明治”结构Sn0.3Ag0.7Cu低银无铅微互连焊点,基于动态力学分析的精密振动疲劳试验与微焊点疲劳断口形貌观察相结合的方法,研究了微焊点振动疲劳变形曲线的形成机制、裂纹萌生扩展与断裂机理、温度对振动疲劳行为的影响及微焊点振动疲劳行为的尺寸效应问题。结果表明,保持焊点直径恒定,随着焊点高度的减小,焊点的疲劳寿命增加,而疲劳断裂应变降低,同时焊点的疲劳断裂模式由韧性断裂转变为脆性断裂。
By adopting a series of typical “sandwich” structures of different sizes close to the actual solder joint volume of the integrated circuit BGA (ball grid array), Flip Chip (flip-chip) Sn0.3Ag0.7Cu low silver leadless micro interconnect Solder joints, dynamic vibration analysis based on the precision vibration fatigue test and the micro-spot fatigue fracture surface morphology combined method to study the formation of micro-weld vibration fatigue deformation curve, crack initiation and propagation and fracture mechanism, the temperature vibration and fatigue Behavioral Effects and Size Effect of Vibration Fatigue Behavior of Micro-Weld. The results show that with the constant welding spot diameter, the fatigue life of the solder joints increases and the fatigue strain decreases when the welding spot height decreases. Meanwhile, the fatigue fracture mode changes from ductile fracture to brittle fracture.