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研究焊点在跌落碰撞状态下的可靠性是研究电子产品可靠性的关键技术之一,本文基于JE-DEC冲击跌落标准对焊料的跌落性能进行了测试,试验过程中充分考虑了焊料的材料组成、助焊剂、焊盘的处理方法以及焊球的大小等因素。焊料选择常用的Sn-3Ag-0.5Cu(SAC305)和Sn-1Ag-0.5Cu(SAC105)和Sn63Pb37,焊盘处理方法为Ni/Au电镀法和有机保焊膜(OSP)涂覆法。运用红油浸渍试验和焊点金相剖面分析对焊点的失效模式和可靠性进行分析,结果表明无铅焊料中银含量较低和焊盘采用OSP涂覆法有利于提高BGA焊点的可靠性。
Studying the reliability of solder joints in the event of a drop impact is one of the key technologies to study the reliability of electronic products. In this paper, the drop performance of solder is tested based on JE-DEC impact drop standard. The solder material composition , Flux, pad processing methods and the size of solder balls and other factors. Solder The commonly used Sn-3Ag-0.5Cu (SAC305) and Sn-1Ag-0.5Cu (SAC105) and Sn63Pb37 are selected. The pad processing methods are Ni / Au plating and OSP coating. Using the oil immersion test and the metallographic section analysis of the solder joint, the failure mode and reliability of the solder joint were analyzed. The results show that the low silver content in the lead-free solder and OSP coating on the solder pad can improve the reliability of BGA solder joint .