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用于先进器件金属化的铜膜的低压化学汽相淀积=Lowpressurechemicalvapordeposi-tioncopperfilmsforadvanceddevicemetalmetal-lization[刊,英]/Kim,D.H.…//J.El...
Low Pressure Chemical Vapor Deposition for Advanced Device Metallization of Copper Films = Lowpressure chemical vapor facility copperfilmsforadvanced servicemetalmetal-lization [Eng., UK] / Kim, D. H. ... // J. El ...