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最近二十年来,MEMS 加工技术的研发在速度和多领域、多用途方面都确实令人叹服。广义上讲,一个微型系统包括微电子机械系统(MEMS:Micro electmmechanic system)、信号转换和处理单元以及电气机械封装等。2000年,包括 MEMS 和微型传感器在内的微型系统的全球销售额令人吃惊,达1100亿美元。工作负载引起的结构元件的过度应力和变形会严重地影响器件的性能。所以,产品的机械设计和电气机械封装不仅要确保产品的预期性能,而且还要使产品性能可靠并有市场竞争力。
In the recent two decades, the research and development of MEMS processing technology has been really impressive in terms of speed and multi-fields. Broadly speaking, a miniature system includes a microelectromechanical system (MEMS), a signal conversion and processing unit, and an electromechanical package. In 2000, worldwide sales of microsystems, including MEMS and micro-sensors, were staggering at $ 110 billion. Overloading and deformation of the structural elements caused by the workload can seriously affect the performance of the device. Therefore, the product’s mechanical design and electrical and mechanical packaging not only ensure the expected performance of the product, but also make the product reliable performance and market competitiveness.