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为了尽快生产型号所用层数多、精度高、可靠性好的多层印制板;更好地实施质量控制;打破这类产品依赖大量进口的被动局面,采用金相法对印制板沿孔径剖开后的金属化内孔进行显微摄影,获得检查宇航产品所用印制板的解剖分析图片,测量孔壁沉积层厚度,对典型坏孔拍摄照片,供生产中查找缺陷产生的原因,有效地实施质量控制。
In order to quickly produce the model used in the number of layers, high precision, good reliability of multi-layer PCB; better implementation of quality control; to break the passive import of these products rely on a large number of imports, the use of metallographic method on the PCB cut along the aperture After the metallization of the hole for microscopic photography, access to check the aerospace products used in the printed plate anatomical analysis of the wall thickness of the hole measurement, the typical bad hole to take pictures for the production of defects to find the reasons for the effective implementation QC.