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自60年代后期采用环氧树脂芯片胶粘剂以来,各种各样的环氧基胶粘剂、涂料和密封剂已经广泛用于混合电路。最近环氧树脂的研制包括以下三方面:军事应用的新的芯片粘接材料、低应力陶瓷密封剂以及新的封装化合物。事实上,新一代的高纯度环氧树脂已开始渗透到了混合电路市场。美国军用标准Mi1—883第5011项就是密封应用的新的芯片粘接标准。几家生产厂已经开发并试制成为满足新技术要求而设计的具有改进纯度和除气性能的先进的胶粘剂。高纯度
A wide range of epoxy-based adhesives, coatings and sealants have been widely used in hybrid circuits since the late 60’s with epoxy chip adhesives. Recent developments in epoxy resins include the following three areas: new die bonding materials for military applications, low-stress ceramic sealants, and new encapsulant compounds. In fact, a new generation of high purity epoxy resin has begun to penetrate the hybrid circuit market. US military standard Mi1-883 Item 5011 is sealed for the new chip bonding standards. Several manufacturing plants have developed and prototyped advanced adhesives with improved purity and outgassing designed to meet new technical requirements. high purity