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东京大学生产技术研究所等开发出无研磨垫片进行半导体和液晶玻璃镜面加工的“复合粒子研磨法”。这是一种不使用可能引起磨具气孔堵塞而必须定期更换的研磨垫片 ,直接把工件压在模板上的加工方法。在接触界面加上磨粒并注入混合直径约 10μm的聚合物粒子的液体。聚合物粒子表?
Tokyo Institute of Technology and other production technology to develop non-polishing pads for semiconductor and liquid crystal glass mirror processing “composite particle grinding method.” This is a do not use may cause abrasive pores and clogging must be regularly replaced by the grinding pad, the workpiece directly on the template on the processing method. Abrasive particles were added to the contact interface and a liquid mixed with polymer particles having a diameter of about 10 μm was injected. Polymer particle table?