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借助于X射线衍射仪、SEM扫描电镜以及EDS能谱分析仪等设备和方法,研究了不同含量Cu(0%、0.5%、1.0%、2.0%、3.0%,质量分数)对Mg-3Sn合金显微组织、热导率以及力学性能的影响规律。实验结果表明,随着Cu含量的增加,Mg-3Sn-xCu合金的显微组织逐渐细化,第二相的析出逐渐增多,并沿晶界连成网状;合金的热导率随Cu含量的增加逐渐升高;抗拉强度和伸长率随Cu含量的增加先升高后降低,当Cu含量为1%时,合金的抗拉强度和伸长率达到最大值。
The effects of different contents of Cu (0%, 0.5%, 1.0%, 2.0%, 3.0%, mass fraction) on the mechanical properties of Mg-3Sn alloy were studied by means of X-ray diffraction, SEM and EDS, Microstructure, thermal conductivity and mechanical properties of the law. The experimental results show that with the increase of Cu content, the microstructure of Mg-3Sn-xCu alloy is gradually refined, the precipitation of the second phase is gradually increased, and the network is connected with the grain boundary. The thermal conductivity of the alloy increases with the Cu content The tensile strength and elongation increase first and then decrease with the increase of Cu content. When Cu content is 1%, the tensile strength and elongation reach the maximum.