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嵌入式微电容技术是一种能够使电子器件微型化,并提高其性能及可靠性的方法.研究适用于嵌入式环境的高介电材料,有着重要的意义.采用粒径为92 nm的钛酸钡(BaTiO3)颗粒作为纳米无机填充颗粒,选用聚酰亚胺(PI)作为有机基体制备新型BaTiO3/PI纳米复合薄膜,并对该薄膜的介电性能、耐压特性及温度特性进行了测试;并采用光刻、溅射、刻蚀等工艺,对BaTiO3/PI纳米复合薄膜进行图形化研究,制造嵌入式微电容器件原型,其后对该器件的介电性能进行了测试.测试结果显示,嵌入式电容器件原型的介电常数在低频下达到15以上,击穿场强达到58 MV/m以上,而刻蚀和溅射工艺对薄膜的性能影响不大.
Embedded micro-capacitance technology is a method that can miniaturize electronic devices and improve their performance and reliability.It is of great significance to study high dielectric materials suitable for embedded environments.Using titanic acid Barium (BaTiO3) particles were used as nano-inorganic filler particles. A novel BaTiO3 / PI nanocomposite film was prepared by using polyimide (PI) as an organic matrix. The dielectric properties, dielectric breakdown voltage and temperature characteristics of the films were tested. And the photolithography, sputtering, etching and other processes, the graphitization of BaTiO3 / PI nanocomposite thin film, the manufacture of embedded micro-capacitance device prototype, then the dielectric properties of the device tested.The test results show that embedded The dielectric constant of the capacitor prototype reached more than 15 at low frequency and the breakdown field strength reached above 58 MV / m, while the etching and sputtering process had little effect on the performance of the film.