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通过在高纯AIN基片表面层区域注入Cu离子及随后恒温退火制取了低能组态的Cu-AlN双晶体。应用透射电子显微术(TEM)及卢瑟夫背散射(RSS)等技术研究了这种双晶体的显微结构性能。纳米尺寸的Cu颗粒与AlN基体之间总呈现出唯一的低能晶体学取向关系。镶嵌在AlN基体中的Cu颗粒常常表现出呈李晶关系的片层状显微组织。这是因为在长大过程中,Cu颗粒通过孪生过程缓解了由于共格关系而产生的弹性应变能。
A Cu-AlN double crystal with low energy configuration was prepared by implanting Cu ions in the surface layer of the high-purity AIN substrate and subsequent isothermal annealing. The microstructural properties of the bicrystals were investigated by transmission electron microscopy (TEM) and Reeseoff backscattering (RSS). The nano-sized Cu particles always exhibit the only low-energy crystallographic orientation relationship with the AlN matrix. Cu particles embedded in AlN matrix often exhibit lamellar microstructure in the Li-Jing relationship. This is because Cu particles relax the elastic strain energy due to the coherent relationship by the twin process during growth.