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引言随着现代工业的飞速发展,在印制电路板上安装的封装器件、集成电路逐渐增多。为了达到高密度组装、定阻抗特性、电源噪声容限指标等电气特性的要求,印制电路板的制造也日趋复杂化,其结构也由单面发展成双面以至多层。在双面或多层印制电路板上,孔是各个导电层之间的互连机构。它的制造经历了由空心铆钉法到金属化法的阶段,而且,正由于金属化孔技术的发展,使得印制板的各个绝缘层之间能够实现可靠的电气连接,多层印制电路板才进入到实用的
INTRODUCTION With the rapid development of modern industry, there is a growing number of integrated circuits for packaged devices on printed circuit boards. In order to meet the requirements of high-density assembly, constant impedance characteristics, power supply noise tolerance targets and other electrical characteristics, the manufacture of printed circuit boards is also increasingly complicated, and its structure has also evolved from single-sided to double-sided. On double-sided or multi-layer printed circuit boards, holes are the interconnecting mechanisms between the various conductive layers. Its manufacture has gone through a process from the hollow rivet method to the metallization method, and due to the development of the metallization hole technology, reliable electrical connection between the individual insulation layers of the printed circuit board is achieved, and the multilayer printed circuit board Only into practical