论文部分内容阅读
杂质对漆包线电气机械性能的影响,在文献[15]中已经阐明。按照每个杂质对铜线(用900℃以下,固溶体状态下,淬过火的铜杆拉制的铜线)开始再结晶温度影响作用排列的杂质元素顺序如下:铅、锑、铋、硒和碲。但是,铜锭和铜杆在轧制过程中的热处理可以使铋和锑的影响发生变化,并颠倒它们在杂质影响表中的先后位置。银的相关系数符号与碲的相关系数符号完全相反(表5)。如果铜杆在冷形变前进行
The effect of impurities on the electrical mechanical properties of enameled wires has been clarified in [15]. The order of the impurity elements arranged according to each impurity on the influence of the recrystallization temperature on the copper wire (copper wire drawn by a copper rod hardened at a temperature of 900 ° C or lower in a solid solution state) is as follows: Lead, Antimony, Bismuth, Selenium and Tellurium . However, the heat treatment of copper ingots and copper rods during the rolling process can change the influence of bismuth and antimony and reverse their position in the list of impurity effects. The sign of the correlation coefficient between silver and tellurium has the opposite sign (Table 5). If the copper rod in cold deformation before