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An Au–Pd–Co–Ni–V brazing alloy was designed for Al N ceramic joining. Its wettability on Al N was studied with the sessile drop method. The results showed that the contact angle was decreased gradually with increasing temperature and the prolonging of holding time. Sound Al N/Al N joints were achieved with the brazing alloy at 1170 °C for 10 min. The microstructure of the Al N/Al N joints was examined by scanning electron microscopy(SEM). It was found that element V played the active role in the interfacial reaction between the ceramic and the brazing alloy. V reacted with N decomposed from Al N, resulted in the formation of V–N compound. Based on the energy-dispersive spectroscopy(EDS)and X-ray diffraction(XRD) analysis results, the V–N reaction product was verified as V2 N. The overall reaction during the brazing process can be described by the following equation: 2V + AlN + 2Pd = V2 N + Pd2 Al.The Al N/Al N joints brazed with the Au–Pd–Co–Ni–V brazing alloy exhibited three-point bend strength of 162.7 MPa at room temperature, and under the bend test the fracture of the joint occurred at the Al N ceramic substrate.
An Au-Pd-Co-Ni-V brazing alloy was designed for Al N ceramic joining. Its wettability on Al N was studied with the sessile drop method. The results showed that the contact angle was decreased gradually with increasing temperature and the prolonging of Sound al N / Al N joints were achieved with the brazing alloy at 1170 ° C for 10 min. The microstructure of the Al N / Al N joints was examined by scanning electron microscopy (SEM). It was found that element V based on the energy-dispersive spectroscopy (EDS) and X-ray diffraction (XRD) analysis results, the V-N reaction product was verified as V2 N. The overall reaction during the brazing process can be described by the following equation: 2V + AlN + 2Pd = V2N + Pd2Al.The AlN / Al N joints brazed with the Au-Pd-Co-Ni-V brazing alloy exhi bited three-point bend strength of 162.7 MPa at room temperature, and under the bend test the fracture of the joint occurred at the Al N ceramic substrate.