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锡铅焊料广泛使用于电子、电讯、航空等工业,随着工业发展及自动化焊接技术的广泛采用,锡铅焊料的消耗日益增多。目前波峰焊机及热浸锡锅中使用的焊料主要是含锡约61％、铅39％的HLSnPb39共晶合金。这种焊料在液态下长期暴露,产生大量氧化渣,不仅浪费了宝贵的锡金属,而且使锡锅中焊料的锡铅比下降,严重影响焊接质量。
Tin-lead solder is widely used in the electronics, telecommunications, aerospace and other industries. With the widespread adoption of industrial development and automated welding technology, the consumption of tin-lead solder is increasing day by day. At present, the solder used in wave soldering machines and hot dip tin pots is mainly HLSnPb39 eutectic alloy containing about 61% tin and 39% lead. This long-term exposure of the solder in the liquid state, resulting in a large amount of oxide slag, not only wasting valuable tin metal, but also the tin-lead ratio of the solder pot decreased, seriously affecting the quality of welding.