Microstructure and penetration behavior of electroformed copper liners of shaped charges during expl

• 作 者: Ailing Fan Wenhuai Tian Qi Sun
• 机 构: DepartmentofMaterialsPhysicsandChemistry,TaiyuanUniversityofScienceandTechnology,210Institute
• 出 处: 北京科技大学学报：英文版
• 发表日期: 2006年1期
• 关键词: 铜 电铸成型 添加剂 微观结构 爆炸变形 锥形装药 electroformation additive microstructure explosive det
• 基金项目: This work was financially supported by the National Natural Science Foundation of China （No. 59971008）.

<正>The microstructure in the electroformed copper liners of shaped charges prepared with different electrolytes was studied by Scanning Electron Microscopy (SEM) and Electron Backscattering Kikuchi Pattern (EBSP) methods. SEM observations revealed t