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将光波元件封装工艺与单片微波集成电路(MMIC)技术结合在一起这一事实已在3～6GHz光波/微波收发组件上得到验证。该组件结构紧凑,体积小(为0.1×1.0×0.9立方英寸),射频增益大于16dB。
The fact that the optical wave device packaging process and the monolithic microwave integrated circuit (MMIC) technology are combined has been verified on the 3 to 6 GHz optical / microwave transceiver module. The compact components, small size (0.1 × 1.0 × 0.9 cubic inches), RF gain greater than 16dB.