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一、经过三年的技术攻关,电子元器件引线可焊性问题已基本解决。现将第一、二批全国统测的引线可焊性合格的产品予以公布。第三批(最后一批)全国统测结果,将根据1984年6月30日前统测单位提供的测试数据,地方企业的由各省、市、自治区电子工业主管部门汇总,直属企业的由元器件局和器件总公司汇总,报部后即行公布。二、各地方企业和直属企业的主管部门可根据部1983年5月宜兴会议上确定的,凡与统测合格产品的制造工艺、引线镀(涂)层、引线材质和线径等相同的系列产品,引线可焊性
First, after three years of technical research, electronic components lead solderability problem has been basically solved. Now the first and second batch of the national test of lead solderability qualified products to be announced. The third batch (the last batch) of the national survey results will be based on test data provided by the survey unit before June 30, 1984, local enterprises by the provinces, municipalities and autonomous regions, the competent authorities of the electronics industry summary, directly under the enterprise by the components Board and Device Corporation summary, newspaper department immediately announced. 2. The competent departments of local enterprises and their immediate subsidiaries may, in accordance with the department's determination at the Yixing Conference in May 1983, establish the same series of manufacturing processes, lead plating (coating) layers, lead materials and wire diameters Product, Lead Solderability