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VLSI封装不断发展,要求新的封装技术以满足多芯片安装基板对高传输速度和高密度布线的要求。微电子封装基板的重要参数是介电常数和导体的电阻率。目前,具有低介电常数并能在空气中大约900℃烧成的新型玻璃-陶瓷材料已研制成功。通过控制Ag-Pd颗粒形状,导体线条可达到非常低的电阻率。对封装基板来说,电设计是需要考虑的一个重要问题。脉冲传输特性受接地面种类和所用布线面的影响极大。因此,对各种多层结构需要测量其基本的脉冲传输特性,如传播延迟、特性阻抗和串扰耦合噪声。随之,便确定了能精确控制基板特性的新工艺。新型多层玻璃-陶瓷基板性能归纳如下: 1)因介电常数低(ε≈3.9),新型MGC基板具有小的传播延迟; 2)由于使用Ag-Pd导体系统,其电阻率低(<4μΩ·cm),而且价格便宜; 3)通过改进电设计,达到了对特性阻抗和串扰耦合噪声的控制; 4)业已研究出要求采用先进新材料的高精度制造工艺。因此,用Ag-Pd布线的低介电常数MGC基板在大规模计算机系统中可用作VLSI多芯片封装基板。
VLSI package continues to evolve, requiring new packaging technologies to meet the high transmission speed and high-density routing requirements of multichip mounting substrates. Microelectronic package substrate is an important parameter of dielectric constant and conductor resistivity. Currently, new glass-ceramic materials with a low dielectric constant and capable of firing in the air at about 900 ° C have been developed. By controlling the shape of the Ag-Pd particles, the conductor lines achieve very low resistivity. For package substrates, electrical design is an important issue to consider. Pulsed transmission characteristics are greatly affected by the type of ground plane and the wiring plane used. Therefore, a variety of multilayer structures need to measure their basic pulse transmission characteristics, such as propagation delay, characteristic impedance and crosstalk coupling noise. As a result, a new process that accurately controls the substrate characteristics has been identified. The performance of the new multilayer glass-ceramic substrate is summarized as follows: 1) The new MGC substrate has a small propagation delay due to its low dielectric constant (ε≈3.9); 2) its resistivity is low due to the use of Ag-Pd conductor system (<4μΩ · Cm) at low cost; 3) control of the characteristic impedance and crosstalk coupling noise is achieved by improving the electrical design; and 4) high-precision manufacturing processes that require advanced new materials have been developed. Therefore, low dielectric constant MGC substrates wired with Ag-Pd can be used as VLSI multi-chip package substrates in large scale computer systems.