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介绍了在不锈钢衬底和Ｎｉ－Ｃｒ应变电阻间ＳｉＯ２薄膜的制做方法，在不宜用热氧化和ＣＶＤ法制做ＳｉＯ２膜的情况下，利用该法是行之有效的．探讨了溅射工艺条件对膜附着力和应力的影响，并指出了制备具有较好附着力和较低应力的方法．
The preparation method of SiO2 thin film between stainless steel substrate and Ni-Cr strain resistance is introduced. It is effective to use this method in the situation that SiO2 film should not be made by thermal oxidation and CVD method. The effects of sputtering process conditions on the adhesion and stress of the films were discussed. The methods of preparing the films with good adhesion and low stress were also pointed out.