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冲截集成电路框架的模具因凸模尺寸很小,且加工精度要求很高,而使制造成本很高。现在日本玉川ハィテツク(设在新泻县北蒲原群笹神材下一分)设计的新结构冲制集成电路框架的模具把原来需要冲裁5～6次压缩到只冲截2次。这样使模具的制造成本和交货期均可下降30～40%。这种模具新技术的关键是对原来分为 n
Punching the IC die frame due to the punch size is small, and the processing accuracy of the high, leaving the manufacturing cost is high. Now Japan’s Tamachiku Hi Tec (located in Niigata Prefecture Kitaharaharaji 笹 Shinya next points) designed a new structure of the integrated circuit die of the original frame punching 5 to 6 times the original compression required to puncture only 2 times. This makes the mold manufacturing costs and delivery can be reduced by 30 to 40%. The key to this new mold technology is divided into the original n