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在钻孔中改善电镀空洞的缺陷 采用高Tg的FR-4基材和小孔径、厚板会使印制板生产中电镀空洞之缺陷增加,解决电镀空洞除改进电镀溶液与操作条件外,钻孔中产生垃圾在孔内是个重要因素,本文提出了要重视钻孔条件的观点,举例高厚径比多层板由于孔内垃圾堵塞,尽管用高压水冲
Defects in plating holes to improve electroplating FR-4 substrate with high Tg and small aperture, thick plate will make the PCB production defects in the electroplating hole to solve the electroplating cavity in addition to improving the plating solution and operating conditions, the drill Hole in the garbage generated in the hole is an important factor, this paper put forward to pay attention to the drilling point of view, for example, due to high thickness than the multi-layer hole junk plug, although the use of high-pressure water red