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中国电子学会电子制造与封装技术分会会刊中国半导体行业协会封装分会会刊CNKI中国期刊全文数据库收录期刊·《中国核心期刊(遴选)数据库》收录期刊《电子与封装》杂志是国内唯一一本专精于电子封装领域、兼顾半导体器件和IC设计与制造、电子元器件以及产品应用的专业性期刊。《电子与封装》从我国电子行业的特点出发,全面刊登电子与微电子及其封装测试领域的前沿技术、科研成果、生产技术、工作经验和发展战略、方向方面的文章,突出封装、组装与测试重点,全面覆盖微电子领域、辐射整个电子行业,已成为国
China Institute of Electronics Manufacturing and Packaging Technology Branch Bulletin China Semiconductor Industry Association Packaging Branch Journal CNKI Chinese Journal Full-text Database Papers · “China’s core periodicals (selection) database” included magazine “Electronics and Packaging” magazine is the only one Specialized in the field of electronic packaging, both semiconductor devices and IC design and manufacturing, electronic components and product applications of professional journals. From the characteristics of China’s electronics industry, Electronics and Packaging comprehensively publishes articles on cutting-edge technology, scientific research achievements, production technology, work experience and development strategies and directions in the field of electronics and microelectronics and packaging and testing, and emphasizes packaging, assembly and Test focus, a comprehensive coverage of the field of microelectronics, radiation throughout the electronics industry, has become a country