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真空电子器件的频率越来越高,作为核心部件的折叠波导慢波结构由于具有独特的优点,在真空器件中必将得到广泛的应用。由于真空器件的尺寸与波长具有共渡性,频率越高,互作用结构的尺度越小,加工误差的要求越来越严格。传统的加工方法很难实现如此微小尺寸的结构,而UV-LIGA技术对于制造这种微型结构是一种很有前途的方法。本文以220GHz折叠波导为研究对象,在中科院电子所行波管设计、计算和仿真模拟软件IESTWT1.0平台上,进行了设计和仿真,对高频慢波结构的相关参数进行了优化,并开展了基于SU8厚胶采用嵌丝式UV-LIGA工艺制备折叠波导互作用结构的工艺实验,主要包括无氧铜WAFER制备、大厚度SU8胶匀胶工艺、光刻工艺、嵌丝工艺、电铸以及去胶工艺等参数的摸索。结果表明采用基于SU8系列光刻胶的UV-LIGA方法可以实现折叠波导慢波结构的制备。
As the frequency of vacuum electronic devices is getting higher and higher, as the core component of the folded waveguide slow-wave structure due to the unique advantages in the vacuum device is bound to be widely used. Due to the coherence of the size and wavelength of the vacuum device, the higher the frequency, the smaller the scale of the interaction structure and the more stringent the requirements of machining error. The traditional processing method is very difficult to achieve such a small size of the structure, and UV-LIGA technology for the manufacture of such a miniature structure is a promising method. In this paper, the 220GHz folded waveguide is taken as the research object. The design and simulation of the wave tube design, calculation and simulation software IESTWT1.0 by the Chinese Academy of Sciences are carried out. The relevant parameters of the high-frequency slow-wave structure are optimized and carried out Based on SU8 thick glue using embedded wire UV-LIGA process of folding waveguide interaction structure of the experimental process, including the preparation of oxygen-free copper WAFER, SU8 glue thick uniform glue process, lithography, wire technology, electroforming and Glue and other parameters to explore the process. The results show that the UV-LIGA method based on SU8 series photo resist can be used to fabricate the folded waveguide slow-wave structure.