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基于4,5-环氧四氢邻苯二甲酸二缩水甘油酯(TDE-85)或N,N,N’,N’-四缩水甘油基-4,4’-二氨基二苯基甲烷(AG-80)与2-氨基苯并噻唑(ABZ)的固化反应,以分阶段升温保温方式制备含刚性苯并噻唑链段的TDE-85/ABZ和AG-80/ABZ耐热环氧树脂材料.DMTA分析显示,TDE-85/ABZ和AG-80/ABZ固化物玻璃化转变温度分别为473 K和495 K.而TGA分析表明,其最大热降解速率对应温度分别为618 K和643 K,在873 K下仍有11%和13%的残余质量.以非等温DSC法研究TDE-85/ABZ和AG-80/ABZ固化反应动力学得出表观活化能分别为67.72 k J·mol-1和63.57 k J·mol-1,证明TDE-85/ABZ和AG-80/ABZ固化反应是以自催化反应机理进行的,动力学数学模型与DSC实验数据相吻合.这可为TDE-85/ABZ和AG-80/ABZ材料在成型加工工艺参数的优化和选择提供技术支撑.
Based on diglycidyl 4,5-epoxytetrahydrophthalate (TDE-85) or N, N, N ’, N’-tetraglycidyl-4,4’-diaminodiphenylmethane AG-80) and 2-aminobenzothiazole (ABZ) were used to prepare TDE-85 / ABZ and AG-80 / ABZ heat-resistant epoxy resin materials with rigid benzothiazole .DMTA analysis showed that the glass transition temperature of TDE-85 / ABZ and AG-80 / ABZ cured products were 473 K and 495 K. The TGA analysis showed that the maximum thermal degradation rates corresponding to 618 K and 643 K, The residual mass is still 11% and 13% at 873 K. The kinetics of curing reaction of TDE-85 / ABZ and AG-80 / ABZ by non-isothermal DSC shows that the apparent activation energies are 67.72 kJ · mol- 1 and 63.57 kJ · mol-1 respectively, proving that the curing reaction of TDE-85 / ABZ and AG-80 / ABZ is based on the autocatalytic reaction mechanism, and the kinetic mathematical model is consistent with the DSC experimental data. / ABZ and AG-80 / ABZ materials in the molding process parameters optimization and selection to provide technical support.